产品展示
联系我们
- 139-1702-3872 何先生
- 上海市青浦区崧秋路229号
-
-
DENKA BG tape
DENKA BG TAPE
1)Very excellent lamination with wafer and easy de-lamination from wafer during backside grinding
2)Completely free from fish-eye, gel, foreign material and so on which may cause damage to wafer
3)As it is free from silicon , detergent and wax compositions in its adhesive, de-lamination of epoxy
4)Protection of semiconductor circuits during the process of wafer backside grinding.
