产品展示
联系我们
- 139-1702-3872 何先生
- 上海市青浦区崧秋路229号
-
-
DENKA DC TAPE
DENKA DC TAPE
1) It has optimum adhesive strength enough to hold chip during
wafer sawing process
2) No contamination on the backside of chip due to deionized
water or silicon dust
3)Smooth pick-up can be possible after a period of long storage4)No tacky stain on the backside of chip after the pickup process5)Due to the above-mentioned characteristic, the dicing and pick-up worksof very thin wafer with 3mil 10mil thickness are possible with this tape
